CASE STUDY: THERMAL COUPLING IN 3-D INTEGRATED CIRCUITS

Book chapter

CASE STUDY: THERMAL COUPLING IN 3-D INTEGRATED CIRCUITS

Vasilis F. Pavlidis, Ioannis Savidis and Eby G. Friedman

pp 381-408

01 Jan 2017

DOI: https://doi.org/10.1016/B978-0-12-410501-0.00014-9

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Abstract

Computer Science

Computer Science, Hardware & Architecture

Engineering

Engineering, Electrical & Electronic

Science & Technology

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Title: CASE STUDY: THERMAL COUPLING IN 3-D INTEGRATED CIRCUITS
Creators: Vasilis F. Pavlidis
Ioannis Savidis
Eby G. Friedman
Publication Details: pp 381-408
Publisher: Morgan Kaufmann Pub Inc; SAN FRANCISCO
Number of pages: 28
Resource Type: Book chapter
Language: English
Academic Unit: Electrical and Computer Engineering
Web of Science ID: WOS:000446685200016
Other Identifier: 991019186789704721

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Web of Science research areas: Computer Science, Hardware & Architecture; Engineering, Electrical & Electronic