Book chapter
Chapter 11 - Physical Design Trends for Interconnects
On-Chip Communication Architectures, pp 403-437
2008
Abstract
This chapter gives the complete overview of physical designing trends for interconnects. The complexity of properly designing interconnects in the DSM regime increases with each successive technology generation. Modeling, following the same trend as design, has also increased in complexity. Many factors contribute to the complexity of properly modeling interconnects. Low power, high–speed circuit techniques are essential to expand battery lifetime, and maintain ambient thermal levels. Understanding the causes and methods to minimize dynamic, short-circuit, and leakage power consumption as applied to interconnect design has become critical. Long, narrow interconnect lines increase the resistive and possibly inductive characteristics of a line, requiring unique design methodologies to enhance system performance. In addition, novel techniques in interconnect design also help alleviate deleterious trends that include longer line lengths, greater line impedances, and increased propagation delays. 3-D interconnects is one such technique that can help reduce the line length, and therefore the line impedance. This technique is explained very briefly.
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Details
- Title
- Chapter 11 - Physical Design Trends for Interconnects
- Creators
- Ioannis SavidisEby G. Friedman
- Publication Details
- On-Chip Communication Architectures, pp 403-437
- Publisher
- Elsevier
- Resource Type
- Book chapter
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Other Identifier
- 991019186783304721