The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials

Book chapter

Open access

Daniel J. Cook, Matthew S. Yeager, Shamik Chakraborty, Donald M. Whiting and Boyle C. Cheng

InTech eBooks, pp 319-328

01 Jan 2012

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https://doi.org/10.5772/36742View

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Physical Sciences

Polymer Science

Science & Technology

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Title: The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials
Creators: Daniel J. Cook - Drexel University
Matthew S. Yeager - Drexel University
Shamik Chakraborty - Allegheny General Hospital
Donald M. Whiting - Drexel University
Boyle C. Cheng - Drexel University
Contributors: A Z ElSonbati (Editor)
Publication Details: InTech eBooks, pp 319-328
Publisher: Intech Europe; RIJEKA
Number of pages: 10
Resource Type: Book chapter
Language: English
Academic Unit: SOM Dean - Research Administration; Surgery
Web of Science ID: WOS:000387426000016
Other Identifier: 991021930320104721

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