Conference proceeding
3D NoCs with Active Interposer for Multi-Die Systems
PROCEEDINGS OF THE 13TH IEEE/ACM INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP (NOCS'19), pp 1-8
01 Jan 2019
Abstract
Advances in interconnect technologies for system-in -package manufacturing have re -introduced multi -chip module (MCM) architectures as an alternative to the current monolithic approach. MCMs or multi -die systems implement multiple smaller chiplets in a single package. These MCMs are connected through various package interconnect technologies, such as current industry solutions in AMD's Infinity Fabric, ntel's Eoveros active interposer, and Marvell's Mochi Interconnect. Although MCMs improve manufacturing yields and are cost-effective, additional challenges on the Network -on Chip (NoC) within a single chiplet and across multiple chiplets need to be addressed. These challenges include routing, scalability performance, and resource allocation. This work introduces a scalable MCM 3D interconnect infrastructure called "MCM-3D-NoC" with multiple 3D chiplets connected through an active interposer. System -level simulations of MCM-3D-NoC are performed to validate the proposed architecture and provide performance evaluation of network latency, throughput, and EDP.
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Details
- Title
- 3D NoCs with Active Interposer for Multi-Die Systems
- Creators
- Vasil Pano - Drexel UniversityRagh Kuttappa - Drexel UniversityBaris Taskin - Drexel UniversityACM
- Publication Details
- PROCEEDINGS OF THE 13TH IEEE/ACM INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP (NOCS'19), pp 1-8
- Conference
- 13TH IEEE/ACM INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP (NOCS'19), 13th
- Publisher
- Assoc Computing Machinery
- Number of pages
- 8
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000526028700014
- Scopus ID
- 2-s2.0-85076626203
- Other Identifier
- 991019167474704721
InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Web of Science research areas
- Computer Science, Theory & Methods
- Engineering, Electrical & Electronic