Conference proceeding
A Multi-Modal Attention-Based Framework for Good Die in Bad Neighborhood Methodology
Proceedings of the ... IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (Online), pp 1-6
21 Oct 2025
Abstract
Detecting latent defects and reducing defective parts per million (DPPM) are crucial for improving semiconductor test quality and reliability. Good Die in Bad Neighborhood (GDBN) identifies and eliminates potentially defective dies, even if they pass standard tests. We propose a multi-modal attention-based framework that uses wafer-level defect visual patterns along with numerical test parametric data to improve GDBN identification. Experiments using the industrial semiconductor wafer dataset WM-811K demonstrate multi-modal fusion with an attention-based model captures more test escapes & a 22 % greater reduction in DPPM compared to existing GDBN methods.
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Details
- Title
- A Multi-Modal Attention-Based Framework for Good Die in Bad Neighborhood Methodology
- Creators
- Mohammad Ershad Shaik - The University of Texas at AustinAbhishek Mishra - Drexel UniversityNagarajan Kandasamy - Drexel UniversityNur A. Touba - The University of Texas at Austin
- Publication Details
- Proceedings of the ... IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (Online), pp 1-6
- Publisher
- IEEE
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Scopus ID
- 2-s2.0-105029652234
- Other Identifier
- 991022138570304721