Conference proceeding
Chip-scale demonstration of 3-D integrated intra-chip free-space optical interconnect
OPTOELECTRONIC INTEGRATED CIRCUITS XIV, v 8265
01 Jan 2012
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
This paper presents the first chip-scale demonstration of an intra-chip free-space optical interconnect (FSOI) we recently proposed. 1 This interconnect system uses point-to-point free-space optical links to construct an all-to-all intra-chip communication network. Unlike other electrical and waveguide-based optical interconnect systems, FSOI exhibits low latency, high energy efficiency, and large bandwidth density with little degradation for long distance transmission, and hence can significantly improve the performance of future many-core chips. A 1x1-cm(2) chip prototype is fabricated on a germanium substrate with integrated photodetectors. A commercial 850-nm GaAs vertical-cavity-surface-emitting-laser (VCSEL) and fabricated fused silica micro-lenses are 3-D integrated on top of the germanium substrate. At a 1.4-cm distance, the measured optical transmission loss is 5 dB and crosstalk is less than -20 dB. The electrical-to-electrical bandwidth is 3.3 GHz, limited by the VCSEL.
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Details
- Title
- Chip-scale demonstration of 3-D integrated intra-chip free-space optical interconnect
- Creators
- Hui Wu - University of RochesterBerkehan Ciftcioglu - University of RochesterRebecca Berman - The Institute of OpticsJianyun Hu - Univ Rochester, Dept Elect & Comp Engn, Rochester, NY 14627 USAShang Wang - University of RochesterIoannis Savidis - University of RochesterManish Jain - The Institute of OpticsDuncan Moore - The Institute of OpticsMichael Huang - University of RochesterEby G. Friedman - University of RochesterGary Wicks - The Institute of Optics
- Contributors
- L A Eldada (Editor)E H Lee (Editor)
- Publication Details
- OPTOELECTRONIC INTEGRATED CIRCUITS XIV, v 8265
- Series
- Proceedings of SPIE
- Publisher
- Spie-Int Soc Optical Engineering
- Number of pages
- 10
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000303345600007
- Scopus ID
- 2-s2.0-84863360766
- Other Identifier
- 991019186779304721
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InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Web of Science research areas
- Engineering, Electrical & Electronic
- Optics