Conference proceeding
Development of A Water Source Heat Pump Hardware-in-the-Loop (HIL) Testing Facility for Smart Building Applications
ASHRAE TRANSACTIONS 2022, VOL 128, PT 2, Vol.128(2), pp.246-254
01 Jan 2022
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
Over the last decade, the global fight against climate change through electrification has led to an increase in research on building heating, ventilation, and air conditioning (HVAC) systems that utilize intelligent control algorithms to provide demand- side grid service while maintaining the thermal comfort of building occupants. As the pivotal point between building electricity consumption and indoor thermal comfort, high-efficiency electrical heat pumps are at the center of these emerging studies, and various grid-interactive and occupant-comfort control algorithms have been developed for them. The impact of these algorithms on the heat pump operation and performance under different weather, building load, and grid requests calls for investigation and verification via experimental tests with actual heat pumps integrated with real-time building and grid responses. This study presents a Water-Source Heat Pump Hardware-in-The-Loop (HIL) Test Facility developed with the capability to perform such tests. The hardware configuration for this test facility introduces a hydronic system that emulates the conditions for the heat pump water-side, and a duct system that emulates conditions for the heat pump airside. Both data acquisition and emulator control are implemented through the National Instruments (NI) LabVIEW software running on an NI PXI platform. The HIL mechanism based on the hardware-software integration that allows the testbed to communicate with a generic simulation environment is also discussed. Currently, the test facility setup includes a single heat pump and virtual building model in EnergyPlus coupled with an occupant behavioral model in MATLAB. Preliminary test results of the current setup demonstrate the building load emulator's ability to track the simulated zone temperature with a Root Mean Square Deviation (RSME) below 0.12 degrees C (0.216 degrees F). An uncertainty analysis based on sensor accuracies shows that the heat pump coefficient of performance (COP) can be measured with a relative uncertainty of 10.4% in cooling and 3.7% in heating. Apart from the current testing on a single heat pump, the test facility also provides the flexibility to include additional heat pumps to form a heat pump cluster, as well as coupling the heat pump with active thermal storage to provide enhanced demand flexibility.
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Details
- Title
- Development of A Water Source Heat Pump Hardware-in-the-Loop (HIL) Testing Facility for Smart Building Applications
- Creators
- Caleb Calfa - Texas A&M Univ, Dept Mech Engn, College Stn, TX 77843 USAZhiyao Yang - Texas A&M Univ, College Stn, TX USAYangyang FuZhelun Chen - Drexel UniversityZheng O'Neill - Texas A&M Univ, Dept Mech Engn, College Stn, TX 77843 USAJin Wen - Drexel UniversityASHRAE
- Publication Details
- ASHRAE TRANSACTIONS 2022, VOL 128, PT 2, Vol.128(2), pp.246-254
- Series
- ASHRAE Transactions
- Publisher
- Amer Soc Heating, Refrigerating And Air-Conditioning Engs
- Number of pages
- 9
- Grant note
- DE-EE0009153 / Building Technologies Office of the U.S. Department of Energy through the Emerging Technologies program; United States Department of Energy (DOE)
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Civil, Architectural, and Environmental Engineering
- Identifiers
- 991021960637304721
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- Collaboration types
- Domestic collaboration
- Web of Science research areas
- Construction & Building Technology
- Engineering, Mechanical