Conference proceeding
Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects
Proceedings of the 20th symposium on great lakes symposium on vlsi, pp 413-416
16 May 2010
Abstract
The electromagnetic interaction of on-chip antennas and metal interconnects modeled in a 250 nm complementary metal-oxide semiconductor (CMOS) technology is investigated. A finite element method (FEM) based 3-D full-wave solver is used to perform the electromagnetic field analysis. It is shown that there can be significant signal coupling between the on-chip transmitting antenna and the metal interconnects on a die (-12.09 dB for a 1.6 mm long, 2 um wide interconnect at a distance of 1 um from the antenna). Design considerations for metal interconnects in the presence of on-chip antennas are presented in order to limit the undesirable electromagnetic coupling.
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1 citations in Scopus
Details
- Title
- Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects
- Creators
- Ankit More - Drexel UniversityBaris Taskin - Drexel University
- Publication Details
- Proceedings of the 20th symposium on great lakes symposium on vlsi, pp 413-416
- Conference
- 20th symposium on great lakes symposium on vlsi, 20th
- Series
- GLSVLSI '10
- Publisher
- Association for Computing Machinery (ACM)
- Number of pages
- 1
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Scopus ID
- 2-s2.0-77954498933
- Other Identifier
- 991019174728704721