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Evaluating the Use of Cyberinfrastructure in the Classroom to Enhance Product Dissection
Conference proceeding   Peer reviewed

Evaluating the Use of Cyberinfrastructure in the Classroom to Enhance Product Dissection

Matt Devendorf, Kemper Lewis, Timothy W Simpson, Robert B Stone, William C Regli, ASME and Kheyandra D Lewis
Volume 3: 19th International Conference on Design Theory and Methodology; 1st International Conference on Micro- and Nanosystems; and 9th International Conference on Advanced Vehicle Tire Technologies, Parts A and B, v 3
01 Jan 2007

Abstract

Recent cyberinfrastructure initiatives seek to create ubiquitous, comprehensive, interactive, and functionally complete digital environments that consist of people, data, information, tools, and instruments for research communities. With product dissection as our unifying theme, we are forging a cyberinfrastructure to support undergraduate design engineering education through CIBER-U: Cyber-Infrastructure-Based Engineering Repositories for Undergraduates. CIBER-U pairs two of the nation’s leading design repository developers with several active users and their students to realize a high-impact application of cyberinfrastructure in engineering undergraduate curricula involving freshmen through seniors. Specifically, CIBER-U combines product dissection activities at three universities with two digital design repositories, CAD modeling and animation, video, MediaWiki technology, multimedia, and undergraduate summer research experiences to enable cyberinfrastructure-based product dissection activities. Nearly 700 students have participated in the Phase I efforts of CIBER-U, which have focused primarily on generating, capturing, and storing data in two digital design repositories. Lessons learned from these efforts are presented from the students’ perspectives as well as that of the faculty in both engineering and computer science. The implications for implementing CIBER-U on a national scale are discussed along with ongoing research.

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Web of Science research areas
Engineering, Mechanical
Nanoscience & Nanotechnology
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