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Conference proceeding
Harnessing Heterogeneity for Targeted Attacks on 3-D ICs
GLSVLSI '24: Proceedings of the Great Lakes Symposium on VLSI 2024, pp 246-251
12 Jun 2024
Featured in Collection : Research Supported by Drexel Libraries' OA Programs
Abstract
As 3-D integrated circuits (ICs) increasingly pervade the microelectronics industry, the integration of heterogeneous components presents a unique challenge from a security perspective. To this end, an attack on a victim die of a multi-tiered heterogeneous 3-D IC is proposed and evaluated. By utilizing on-chip inductive circuits and transistors with low voltage threshold (LVT), a die based on CMOS technology is proposed that includes a sensor to monitor the electromagnetic (EM) emissions from the normal function of a victim die, without requiring physical probing. The adversarial circuit is self-powered through the use of thermocouples that supply the generated current to circuits that sense EM emissions. Therefore, the integration of disparate technologies in a single 3-D circuit allows for a stealthy, wireless, and non-invasive side-channel attack. A thin-film thermo-electric generator (TEG) is developed that produces a 115 mV voltage source, which is amplified 5 × through a voltage booster to provide power to the adversarial circuit. An on-chip inductor is also developed as a component of a sensing array, which detects changes to the magnetic field induced by the computational activity of the victim die. In addition, the challenges associated with detecting and mitigating such attacks are discussed, highlighting the limitations of existing security mechanisms in addressing the multifaceted nature of vulnerabilities due to the heterogeneity of 3-D ICs.
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Details
- Title
- Harnessing Heterogeneity for Targeted Attacks on 3-D ICs
- Creators
- Alec Aversa (Corresponding Author)Ioannis Savidis - Drexel University, Electrical and Computer Engineering
- Publication Details
- GLSVLSI '24: Proceedings of the Great Lakes Symposium on VLSI 2024, pp 246-251
- Conference
- GLSVLSI '24: Great Lakes Symposium on VLSI 2024 (Clearwater, Florida, 12 Jun 2024–14 Jun 2024)
- Publisher
- Association for Computing Machinery; New York, NY
- Number of pages
- 6
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:001253690000039
- Scopus ID
- 2-s2.0-85197952974
- Other Identifier
- 991021883715604721
InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Web of Science research areas
- Computer Science, Hardware & Architecture
- Computer Science, Information Systems
- Computer Science, Software Engineering
- Computer Science, Theory & Methods