Conference proceeding
Heterogeneous System-Level Package Integration - Trends and Challenges
2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY, v 2020-, pp 1-2
01 Jan 2020
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
Heterogeneous package-level integration plays an increasing role in higher functional density and lower power processors for general computing, machine learning and mobile applications. This paper will review technology trends and challenges for 2.5D and 3D package-level integration with special focus on system-technology co-optimization of the die partitioning, electrical interfaces, power delivery, thermal modeling and EDA flows.
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Details
- Title
- Heterogeneous System-Level Package Integration - Trends and Challenges
- Creators
- Frank J. C. Lee - Taiwan Semicond Mfg Co, Hsinchu, TaiwanMei Wong - Taiwan Semiconductor Manufacturing Company (Taiwan)Jerry Tzou - Taiwan Semiconductor Manufacturing Company (Taiwan)Jonathan Yuan - Taiwan Semiconductor Manufacturing Company (Taiwan)Daniel Chang - Taiwan Semiconductor Manufacturing Company (Taiwan)Stefan Rusu - Taiwan Semiconductor Manufacturing Company (Taiwan)IEEE
- Publication Details
- 2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY, v 2020-, pp 1-2
- Series
- Symposium on VLSI Technology
- Publisher
- IEEE
- Number of pages
- 2
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Digital Media
- Web of Science ID
- WOS:000668063000069
- Scopus ID
- 2-s2.0-85098168039
- Other Identifier
- 991020594690604721
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Data related to this publication, from InCites Benchmarking & Analytics tool:
- Web of Science research areas
- Computer Science, Hardware & Architecture
- Engineering, Electrical & Electronic