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Innovative propagation mechanism for inter-chip and intra-chip communication
Conference proceeding

Innovative propagation mechanism for inter-chip and intra-chip communication

Yuqiao Liu, Vasil Pano, Damiano Patron, Kapil Dandekar and Baris Taskin
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings
01 Apr 2015

Abstract

Printed circuit boards Semiconductors Silicon wafers Wireless networks

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