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This material is based on research sponsored by Air Force Research Laboratory under Agreement Number FA8650-20-2-5506, as conducted through the flexible hybrid electronics manufacturing innovation institute, NextFlex, in support of U.S. Army DEVCOM Soldier Center. The U.S. Government is authorized to reproduce and distribute reprints for Governmental Purposes notwithstanding any copyright notation thereon. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of Air Force Research Laboratory, the U.S. Army DEVCOM -Soldier Center or the U.S. Government.