Conference proceeding
Numerical derivative analysis of load-displacement curves in depth-sensing indentation
MECHANICAL PROPERTIES OF NANOSTRUCTURED MATERIALS AND NANOCOMPOSITES, Vol.791, pp.191-201
Materials Research Society Symposium Proceedings
01 Jan 2004
Abstract
The use of load-displacement derivative behavior and power-law curve fitting is applied to find the location of events for a number of different materials during depth-sensing indentation. Load-displacement curves for Berkovich indentations on fused silica, fullerene thin film on sapphire, CdTe thin film on silicon, single crystal silicon, carbide derived carbon, and a polymethylmethacrylate/hydroxyapatite (PMMA/HA) particle composite are examined. The analysis is applied to quantify the location of different events that occur during material loading and unloading.
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Details
- Title
- Numerical derivative analysis of load-displacement curves in depth-sensing indentation
- Creators
- T JulianoDominichT BuchheitY Gogotsi
- Contributors
- Ovidko (Editor)C S Pande (Editor)R Krishnamoorti (Editor)E Lavernia (Editor)G Skandan (Editor)
- Publication Details
- MECHANICAL PROPERTIES OF NANOSTRUCTURED MATERIALS AND NANOCOMPOSITES, Vol.791, pp.191-201
- Series
- Materials Research Society Symposium Proceedings
- Publisher
- Materials Research Soc
- Number of pages
- 11
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Materials Science and Engineering
- Identifiers
- 991019170577704721
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- Materials Science, Coatings & Films
- Materials Science, Composites
- Materials Science, Multidisciplinary