Conference proceeding
Reworkable Superconducting Qubit Package for Quantum Computing
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), pp 427-432
28 May 2024
Abstract
This paper describes a novel multi-metal layered interconnect-based heterogeneous integration approach for developing a reworkable superconducting qubit package. Various microbump options, including gold, tin, indium, and tin indium, were used to achieve the desired flip-chip configurations. As a case study, we demonstrate a reworkable cryogenic superconducting qubit package capable of interconnecting up to 32 microwave lines. The flip-chip package configurations show low (below 30 dB @ RT) nearest-neighbor crosstalk up to 10 GHz. Initial qubit measurements at low temperatures (~10 mK) show qubit lifetime T 1 > 100 μs (Q > 2M), which is comparable to the planar versions measured in our standard Al wirebonded package. Keywords-qubit, heterogeneous integration, interconnect, flip-chip, crosstalk.
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Details
- Title
- Reworkable Superconducting Qubit Package for Quantum Computing
- Creators
- Rabindra N. Das - MIT Lincoln LaboratoryJohn Cummings - MIT Lincoln LaboratoryThomas Hazard - MIT Lincoln LaboratoryDanna Rosenberg - MIT Lincoln LaboratoryDavid Conway - MIT Lincoln LaboratoryShireen Warnock - MIT Lincoln LaboratoryMichael Gingras - MIT Lincoln LaboratoryBethany Huffman - MIT Lincoln LaboratoryCyrus F. Hirjibehedin - MIT Lincoln LaboratorySteven Weber - MIT Lincoln LaboratoryJonilyn Yoder - MIT Lincoln LaboratoryMollie Schwartz - MIT Lincoln Laboratory
- Publication Details
- 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), pp 427-432
- Publisher
- IEEE
- Grant note
- Office of Science (10.13039/100006132) U.S. Department of Energy (10.13039/100000015)
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Scopus ID
- 2-s2.0-85197723646
- Other Identifier
- 991021892015704721