Conference proceeding
Simulation Based Feasibility Study of Wireless RF Interconnects for 3D ICs
IEEE ANNUAL SYMPOSIUM ON VLSI (ISVLSI 2010), pp 228-231
01 Jan 2010
Abstract
A feasibility study of inter-tier wireless interconnects to be used in conjunction with through silicon vias (TSVs) for global communication in 3D ICs is presented. The feasibility is shown by performing a full wave electromagnetic analysis of on-chip communicating antennas on a 3D IC, modeled according to a fully-depleted silicon on insulator (FDSOI) 3D circuit integration technology. It is shown that the selected transmitting and receiving antennas provide a strong signal coupling at the adjacent (-6.67 dB) and the non-adjacent (-6.93 dB) tiers of the 3D IC at a radiation frequency of 10GHz. In addition to permitting non-adjacent tier communication, wireless interconnects are superior to TSVs in permitting non-vertically aligned connections between IC tiers.
Metrics
Details
- Title
- Simulation Based Feasibility Study of Wireless RF Interconnects for 3D ICs
- Creators
- Ankit More - Drexel UniversityBaris Taskin - Drexel UniversityIEEE Comp Soc
- Publication Details
- IEEE ANNUAL SYMPOSIUM ON VLSI (ISVLSI 2010), pp 228-231
- Series
- IEEE Computer Society Annual Symposium on VLSI
- Publisher
- IEEE
- Number of pages
- 4
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000407131800044
- Scopus ID
- 2-s2.0-77957914605
- Other Identifier
- 991019168515904721
InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Web of Science research areas
- Computer Science, Hardware & Architecture
- Engineering, Electrical & Electronic