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Simulation based study of wireless RF interconnects for practical CMOs implementation
Conference proceeding

Simulation based study of wireless RF interconnects for practical CMOs implementation

Ankit More and Baris Taskin
Proceedings of the 12th ACM/IEEE international workshop on system level interconnect prediction, pp 35-42
13 Jun 2010
DOI: https://doi.org/10.1145/1811100.1811111

Abstract

electromagnetic interconnects on-chip antennas vlsi
An electromagnetic analysis for the practical implementation of on-chip antennas to be used as wireless IC interconnects is presented. The undesired electromagnetic signal coupling between the on-chip antennas and the metal interconnects is characterized under varying geometries and placement of the metal interconnects. The variations in the transmission gain between the antenna pair due to the typical complementary metal oxide semiconductor (CMOS) manufacturing requirements are presented. Using a 3-D finite element method (FEM) based full wave electromagnetic solver, it is shown that the antenna characteristics are significantly impacted by the presence of the essential epitaxial layer and the required minimum metal utilization. It is also shown in a 250nm CMOS technology that there can be a significant electromagnetic signal coupling between the on-chip transmitting antenna and the metal interconnects on a die (-12.09dB for a 1.6mm long, 2μm wide interconnect at a distance of 1μm from the antenna). Design considerations are presented for the metal interconnects in the presence of on-chip antennas in order to minimize the undesired electromagnetic signal coupling.

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