Simulation of an Ultrasonic Bonding Tool

Conference proceeding

Simulation of an Ultrasonic Bonding Tool

X Li, N.M Bilgutay, M McBrearty and J.R Prybella

IEEE 1985 Ultrasonics Symposium, pp 567-571

1985

DOI: https://doi.org/10.1109/ULTSYM.1985.198573

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Abstract

Analytical models

Bonding processes

Computational modeling

Impedance

Integrated circuit modeling

Phase locked loops

Resonant frequency

Vibrations

Voltage

Wire

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Details

Title: Simulation of an Ultrasonic Bonding Tool
Creators: X Li
N.M Bilgutay
M McBrearty
J.R Prybella
Publication Details: IEEE 1985 Ultrasonics Symposium, pp 567-571
Publisher: IEEE
Resource Type: Conference proceeding
Language: English
Academic Unit: Materials Science and Engineering
Scopus ID: 2-s2.0-0022334706
Other Identifier: 991019182644004721