Conference proceeding
Thermal Characterization of Select Metallic Phase Change Materials for Transient Load Thermal Management
InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp 1-6
27 May 2025
Abstract
Metallic phase change materials (PCMs) are an attractive option to balance quick response for transient load leveling due to their higher thermal conductivity, however, information for complete thermal characterization is only available for select materials. In this study, nine alloys were completely tested for density, melting temperature, latent heat, specific heat, thermal diffusivity, and solid thermal conductivity using differential scanning calorimetry (DSC), discovery xenon flash (DXF), and volume displacement methods. Results of the above combination of testing procedures has focused the interest of authors towards an alloy composed of50 \%Indium50 \%Tin, known by its manufacturer as Indalloy 1. Indalloy 1 exhibited uniform and predictable phase change behavior while undergoing thermal cycling. The PCM Power Figure of Merit was calculated for Indalloy 1, Indalloy 27, Indalloy 174, and Field's Metal as 85.7,61.1,69.8 , and 58, respectively in units of\mathrm{kJ} / \mathrm{m}^{2}-\mathrm{K}^{0.5}-\mathrm{s}^{0.5} . Indalloy 1 with a high FOM of85.7 \mathrm{~kJ} / \mathrm{m}^{2}-\mathrm{K}^{0.5-} \mathrm{s}^{0.5}demonstrates performance comparable to Field's Metal, a well-established alloy, but with a higher transition temperature, making it better suited for certain applications. These findings support further studies into Indalloy 1 as a candidate for advanced thermal management solutions.
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Details
- Title
- Thermal Characterization of Select Metallic Phase Change Materials for Transient Load Thermal Management
- Creators
- Kayden T. Maiorine - Drexel UniversityRachel C. McAfee - DEVCOM Army Research LaboratoryHarshil M. Patel - Drexel UniversityAdam A. Wilson - DEVCOM Army Research LaboratoryMichael C. Fish - DEVCOM Army Research Laboratory
- Publication Details
- InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp 1-6
- Publisher
- IEEE
- Number of pages
- 6
- Grant note
- Arm (10.13039/100016311)
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Materials Science and Engineering
- Scopus ID
- 2-s2.0-105029473435
- Other Identifier
- 991022197303604721