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Ultrasonic guided wave monitoring of composite bonded joints using macro fiber composite transducers
Conference proceeding

Ultrasonic guided wave monitoring of composite bonded joints using macro fiber composite transducers

Howard Matt, Ivan Bartoli, Stefano Coccia, Francesco Lanza di Scalea, Joseph Oliver, John Kosmatka, Gyuhae Park and Charles Farrar
Proceedings of SPIE, v 6174(1), pp 61742D-61742D-9
16 Mar 2006

Abstract

The monitoring of adhesively-bonded joints through the use of ultrasonic guided waves is the general topic of this paper. Specifically, composite-to-composite joints representative of the wing skin-to-spar bonds of Unmanned Aerial Vehicles (UAVs) are examined. This research is the first step towards the development of an on-board structural health monitoring system for UAV wings based on integrated ultrasonic sensors. The study investigates two different lay-ups for the wing skin and two different types of bond defects, namely poorly-cured adhesive and disbonded interfaces. The guided wave propagation problem is studied numerically by a semi-analytical finite element method that accounts for viscoelastic damping, and experimentally by utilizing macro fiber composite (MFC) transducers which are inexpensive, flexible, highly robust, and viable candidates for application in on-board monitoring systems. Based upon change in energy transmission, the presence of damage is successfully identified through features extracted in both the time domain and discrete wavelet transform domain. A unique "passive" version of the diagnostic system is also demonstrated experimentally, whereby MFC sensors are utilized for detecting and locating simulated active damage in an aluminum plate. By exploiting the directivity behavior of MFC sensors, a damage location algorithm which is independent of wave speed is developed. Application of this approach in CFRP components may alleviate difficulties associated with damage location in highly anisotropic systems.

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Collaboration types
Domestic collaboration
Web of Science research areas
Engineering, Aerospace
Engineering, Civil
Engineering, Mechanical
Instruments & Instrumentation
Telecommunications
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