Conference proceeding
Ultrasound for defect detection and grading in wood and lumber
2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121), v 1, pp 771-778
2000
Abstract
Ultrasonic inspection of solid wood and lumber has been investigated for over 20 years, with limited commercial impact. Potential applications run from logs to finished boards, with the goal of either characterizing internal defects (knots, splits, rot), or assessing overall strength. This paper reviews recent efforts to apply ultrasound technology to the Forest Products industry.
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Details
- Title
- Ultrasound for defect detection and grading in wood and lumber
- Creators
- M.E. Schafer - Perceptron Inc (United States, Plymouth Meeting)
- Publication Details
- 2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121), v 1, pp 771-778
- Conference
- 2000 IEEE Ultrasonics Symposium (San Juan, Puerto Rico, United States, 22 Oct 2000–25 Oct 2000)
- Publisher
- IEEE
- Number of pages
- 8
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- School of Biomedical Engineering, Science, and Health Systems
- Web of Science ID
- WOS:000171881300164
- Other Identifier
- 991019737915104721
InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Web of Science research areas
- Acoustics
- Engineering, Industrial
- Radiology, Nuclear Medicine & Medical Imaging