In integrated circuit design, the analysis of wafer map patterns is critical to improve yield and detect manufacturing issues. We develop Wafer2Spike, an architecture for wafer map pattern classification using a spiking neural network (SNN), and demonstrate that a well-trained SNN achieves superior performance compared to deep neural network-based solutions. Wafer2Spike achieves an average classification accuracy of 98% on the WM-811k wafer benchmark dataset. It is also superior to existing approaches for classifying defect patterns that are underrepresented in the original dataset. Wafer2Spike achieves this improved precision with great computational efficiency.
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Details
Title
Wafer2Spike: Spiking Neural Network for Wafer Map Pattern Classification
Creators
Abhishek Mishra - Drexel University
Suman Kumar - Drexel University
Anush Lingamoorthy - Drexel University
Anup Das - Drexel University
Nagarajan Kandasamy - Drexel University
Publication Details
Proceedings - International Test Conference, pp 16-20
Publisher
IEEE
Grant note
National Science Foundation (10.13039/100000001)
Resource Type
Conference proceeding
Language
English
Academic Unit
Electrical and Computer Engineering; College of Engineering