Conference proceeding
Wafer2Spike: Spiking Neural Network for Wafer Map Pattern Classification
Proceedings - International Test Conference, pp 16-20
03 Nov 2024
Abstract
In integrated circuit design, the analysis of wafer map patterns is critical to improve yield and detect manufacturing issues. We develop Wafer2Spike, an architecture for wafer map pattern classification using a spiking neural network (SNN), and demonstrate that a well-trained SNN achieves superior performance compared to deep neural network-based solutions. Wafer2Spike achieves an average classification accuracy of 98% on the WM-811k wafer benchmark dataset. It is also superior to existing approaches for classifying defect patterns that are underrepresented in the original dataset. Wafer2Spike achieves this improved precision with great computational efficiency.
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Details
- Title
- Wafer2Spike: Spiking Neural Network for Wafer Map Pattern Classification
- Creators
- Abhishek Mishra - Drexel UniversitySuman Kumar - Drexel UniversityAnush Lingamoorthy - Drexel UniversityAnup Das - Drexel UniversityNagarajan Kandasamy - Drexel University
- Publication Details
- Proceedings - International Test Conference, pp 16-20
- Publisher
- IEEE
- Grant note
- National Science Foundation (10.13039/100000001)
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Electrical and Computer Engineering; College of Engineering
- Scopus ID
- 2-s2.0-85212971685
- Other Identifier
- 991021985101404721