Conference proceeding
Wireless Interconnects for Inter-tier Communication on 3D ICs
2010 40th European Microwave Conference
01 Jan 2010
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
The feasibility of on-chip antennas for inter-tier communication on a 3D integrated circuit (IC) stack is shown for two different 3D integration processes. The on-chip antennas for inter-tier wireless interconnects are proposed to be used in conjunction with through silicon vias (TSVs) for global communication in 3D ICs. A 3D finite element method (FEM) based full wave electro-magnetic analysis of two different 3D IC models is presented: a fully depleted silicon on insulator (FDSOI) oxide-oxide bonding 3D circuit integration technology and a complimentary metal oxide semiconductor (CMOS) silicon on insulator (SoI) Benzocyclobutene (BCB) polymer adhesive bonding 3D circuit integration technology. It is shown that the selected transmitting and receiving antennas provide a strong signal coupling at a radiation frequency of 10GHz for both 3D integration processes. In particular, the transmission gains between the antenna pair are -6.92 dB and -5.23 dB for communication between the first and the third IC tiers of a 3D IC for the oxide-oxide and the BCB polymer adhesive bonding techniques, respectively.
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Details
- Title
- Wireless Interconnects for Inter-tier Communication on 3D ICs
- Creators
- Ankit More - Drexel Univ, Dept Elect & Comp Engn, 3141 Chestnut St, Philadelphia, PA 19104 USABaris Taskin - Drexel University
- Publication Details
- 2010 40th European Microwave Conference
- Conference
- 2010 40th European Microwave Conference, 40th (Paris, France, 28 Sep 2010–30 Sep 2010)
- Series
- European Microwave Conference
- Publisher
- IEEE
- Number of pages
- 4
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000411276200027
- Other Identifier
- 991019170472504721
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InCites Highlights
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- Web of Science research areas
- Engineering, Electrical & Electronic
- Telecommunications