Conference proceeding
Wireless on Networks-on-Chip
2013 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP)
Jun 2013
Abstract
On-chip wireless interconnects are being investigated for applicability on network-on-chip systems of contemporary Multiprocessor Systems-on-chip (MPSoCs). Targeting both 2D and 3D semiconductor technologies, wireless interconnects are established with multiple antennas on the same die or couplers on the layers of a 3D IC package. The wireless interconnects are typically considered as a hierarchical layer or a supplementary network utilized in a hybrid implementation with the traditional wire-based interconnects of the common network-on-chip implementations.
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Details
- Title
- Wireless on Networks-on-Chip
- Creators
- Baris Taskin - Drexel University, Electrical and Computer Engineering
- Publication Details
- 2013 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP)
- Conference
- 2013 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP) (Austin, Texas, United States, 02 Jun 2013–02 Jun 2013)
- Publisher
- IEEE
- Resource Type
- Conference proceeding
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Scopus ID
- 2-s2.0-84893358919
- Other Identifier
- 991019170463604721