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PDFOpen Access (License Unspecified), Open Access
- Title
- In-process modeling and analysis of ultrasonic wire bonders
- Creators
- Seogsoon Kim
- Awarding Institution
- Drexel University
- Degree Awarded
- Doctor of Philosophy (Ph.D.)
- Publisher
- Drexel University; Philadelphia, Pennsylvania
- Number of pages
- xiv, 207 pages
- Resource Type
- Dissertation
- Language
- English
- Academic Unit
- Drexel University
- Other Identifier
- 991021888800204721