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Khadpe-Kamat_Subash_19742.59 MB
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- Title
- Study of ultrasonic bonding of microcircuit interconnections
- Creators
- Subash Khadpe-Kamat
- Awarding Institution
- Drexel University
- Degree Awarded
- Doctor of Philosophy (Ph.D.)
- Publisher
- Drexel University; Philadelphia, Pennsylvania
- Number of pages
- x, 113 pages
- Resource Type
- Dissertation
- Language
- English
- Academic Unit
- College of Engineering (1970-2026); Drexel University
- Other Identifier
- 991021888093704721