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Ball bonder rear Y slide noise and vibration reduction with tuned mass dampers
Thesis   Open access

Ball bonder rear Y slide noise and vibration reduction with tuned mass dampers

David J. Haruch
Master of Science (M.S.), Drexel University
Jun 2022
DOI:
https://doi.org/10.17918/00001153
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Abstract

Ball bonder Tuned mass dampers Wire bonder XY table
As technology advances, demand for higher speed, higher precision machine tools and assembly equipment drives research to meet this demand. Ball bonder machines create small wire bonds between a silicon die and an assembly package by moving a set of automatic bonding tools along a programmed path as fast as possible to create a complete semiconductor device. Recent industry trends have shown demand to reduce noise and vibration during XY motion table movement. Some existing methods to reduce noise and vibration in XY table systems have significant cost or moving mass implications, which can be undesirable for the moving masses in a high speed ball bonder machine. A tuned mass damper (TMD) is proposed as a solution method to reduce noise and vibration of a certain ball bonder machine XY table component. The relevant portions of the machine were characterized with experimental modal testing and finite element models. Satisfactory agreement was found between FEA and modal/acoustic testing. Optimal design parameters and their sensitivities for the proposed tuned mass dampers were investigated in simulation. Optimal parameters for a robust mass damper design were found to differ from traditional optimal design parameters. Multiple iterations of prototype TMDs were conceptualized and fabricated to fit within packaging constraints, material limitations, and environmental factors. The performance of these prototypes were tested on a complete ball bonder machine. The prototypes showed satisfactory performance to the target mode, but did not show broadband noise or vibration reduction.

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