Thesis
Closed loop control of wire loop profile on wire bonders
Master of Science (M.S.), Drexel University
Sep 2009
DOI:
https://doi.org/10.17918/00009146
Abstract
Wire Bonding involves establishing interconnections between a microchip and other electronic pars during semiconductor device packaging process. The wires are welded using thermosonic or thermo compression bonding. One of the major challenges in wire bonding that affects performance and reliability is the formation of wire bond loop. The wire bond loop shape needs to satisfy all the complex interconnections required by the semiconductor device within industry standards as well as the device dimensions and pad spacing constraints. The wire loop is characterized by its shape, length and height which collectively define a 'Loop Profile'. This paper presents a detailed analysis of the factors that determine the shape of a mechanically stable wire towards establishing closed loop control of the loop profile on the wire bonder. Mechanically stable configuration is determined from the analysis of factors affecting loop shapes via a collection of experiments performed on the wire bonder. The relationship between the parameters used to construct different wires and the actual shape of the wire is used to construct a model that simulates the wire bonder. Furthermore, the paper explores ways to achieve closed loop optimization by using on bonder measurements and development of optimization algorithms. 'Advanced Process Control [APC] ideologies are collaborated into advanced optimization algorithms using MatLab® and on-bonder wire loop measurement features to automate and culminate precise loop profile development incorporating external factors. This effort will help curtail expenditure and save time prodigiously.
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Details
- Title
- Closed loop control of wire loop profile on wire bonders
- Creators
- Basil Milton
- Contributors
- Ivy W. Qin (Advisor) - Drexel University, Drexel University (1970-)
- Awarding Institution
- Drexel University
- Degree Awarded
- Master of Science (M.S.)
- Publisher
- Drexel University; Philadelphia, Pennsylvania
- Number of pages
- xii, 135 pages
- Resource Type
- Thesis
- Language
- English
- Academic Unit
- College of Engineering (1970-2026); Mechanical Engineering (and Mechanics) (1970-2026); Drexel University
- Other Identifier
- 991021889104304721