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PDFOpen Access (License Unspecified), Open Access
Thesis
Microvoid-based toughening of epoxy resins through the reactive encapsulation of solvent
Master of Science (M.S.), Drexel University
Dec 2010
DOI:
https://doi.org/10.17918/etd-4031
Abstract
An experimental investigation to improve fracture toughness of thermosets by introducing nano-cavitation, as suggested by molecular dynamics simulations of Mukherji and Abrams [1] is presented here. We introduce nano-cavities in an amine cured epoxy network by employing the method of reactive encapsulation of a non-reactive solvent, tetrahydrofuran. The solvent was then extracted in a slow post-cure process, leaving homogeneously distributed collapsed voids. We find that the fracture toughness can be improved about 200% for a 10% solvent inclusion and about 500% for a 15% solvent inclusion. Differential scanning calorimetry and dynamic mechanical analysis showed that the glass transition temperature for the network without solvent is equivalent to that of the solvent extracted network.
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Details
- Title
- Microvoid-based toughening of epoxy resins through the reactive encapsulation of solvent
- Creators
- Donald George Campbell - DU
- Contributors
- Giuseppe R. Palmese (Advisor) - Drexel University (1970-)
- Awarding Institution
- Drexel University
- Degree Awarded
- Master of Science (M.S.)
- Publisher
- Drexel University; Philadelphia, Pennsylvania
- Resource Type
- Thesis
- Language
- English
- Academic Unit
- Chemical (and Biological) Engineering [Historical]; College of Engineering (1970-2026); Drexel University
- Other Identifier
- 4031; 991014632225304721