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Journal article
3-D integrated heterogeneous intra-chip free-space optical interconnect
Optics express, v 20(4), pp 4331-4345
13 Feb 2012
PMID: 22418191
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
This paper presents the first chip-scale demonstration of an intra-chip free-space optical interconnect (FSOI) we recently proposed. This interconnect system provides point-to-point free-space optical links between any two communication nodes, and hence constructs an all-to-all intra-chip communication fabric, which can be extended for inter-chip communications as well. Unlike electrical and other waveguide-based optical interconnects, FSOI exhibits low latency, high energy efficiency, and large band width density, and hence can significantly improve the performance of future many-core chips. In this paper, we evaluate the performance of the proposed FSOI interconnect, and compare it to a waveguide-based optical interconnect with wavelength division multiplexing (WDM). It shows that the FSOI system can achieve significantly lower loss and higher energy efficiency than the WDM system, even with optimistic assumptions for the latter. A 1 x 1-cm(2) chip prototype is fabricated on a germanium substrate with integrated photodetectors. Commercial 850-nm GaAs vertical-cavity-surface-emitting-lasers (VCSELs) and fabricated fused silica microlenses are 3-D integrated on top of the substrate. At 1.4-cm distance, the measured optical transmission loss is 5 dB, the crosstalk is less than -20 dB, and the electrical-to-electrical bandwidth is 3.3 GHz. The latter is mainly limited by the 5-GHz VCSEL. (C) 2012 Optical Society of America
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Details
- Title
- 3-D integrated heterogeneous intra-chip free-space optical interconnect
- Creators
- Berkehan Ciftcioglu - University of RochesterRebecca Berman - The Institute of OpticsShang Wang - University of RochesterJianyun Hu - University of RochesterIoannis Savidis - University of RochesterManish Jain - The Institute of OpticsDuncan Moore - The Institute of OpticsMichael Huang - University of RochesterEby G. Friedman - University of RochesterGary Wicks - The Institute of OpticsHui Wu - University of Rochester
- Publication Details
- Optics express, v 20(4), pp 4331-4345
- Publisher
- Optical Soc Amer
- Number of pages
- 15
- Grant note
- New York State Energy Research and Development Authority DE-FC52-08NA28302 / DOE Office of Inertial Confinement Fusion; United States Department of Energy (DOE) Cornell Nanofabrication Facility University of Rochester 0829915 / Direct For Computer & Info Scie & Enginr; National Science Foundation (NSF); NSF - Directorate for Computer & Information Science & Engineering (CISE) CCF0829915; DMR1124601 / NSF; National Science Foundation (NSF) DOE; United States Department of Energy (DOE)
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000301041900097
- Scopus ID
- 2-s2.0-84863151365
- Other Identifier
- 991019186633204721
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- Web of Science research areas
- Optics