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Journal article
A 3-D Integrated Intrachip Free-Space Optical Interconnect for Many-Core Chips
IEEE photonics technology letters, v 23(3), pp 164-166
01 Feb 2011
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
This letter presents a new optical interconnect system for intrachip communications based on free-space optics. It provides all-to-all direct communications using dedicated lasers and photodetectors, hence avoiding packet switching while offering ultra-low latency and scalable bandwidth. A technology demonstration prototype is built on a circuit board using fabricated germanium photodetectors, micro-lenses, commercial vertical-cavity surface-emitting lasers, and micro-mirrors. Transmission loss in an optical link of 10-mm distance and crosstalk between two adjacent links are measured as 5 and -26 dB, respectively. The measured small-signal bandwidth of the link is 10 GHz.
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Details
- Title
- A 3-D Integrated Intrachip Free-Space Optical Interconnect for Many-Core Chips
- Creators
- Berkehan Ciftcioglu - Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USARebecca Berman - Univ Rochester, Inst Opt, Rochester, NY 14627 USAJian Zhang - Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USAZach Darling - Univ Rochester, Inst Opt, Rochester, NY 14627 USAShang Wang - Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USAJianyun Hu - Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USAJing Xue - Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USAAlok Garg - Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USAManish Jain - Univ Rochester, Inst Opt, Rochester, NY 14627 USAIoannis Savidis - Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USADuncan Moore - Univ Rochester, Inst Opt, Rochester, NY 14627 USAMichael Huang - Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USAEby G. Friedman - Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USAGary Wicks - Univ Rochester, Inst Opt, Rochester, NY 14627 USAHui Wu - Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USA
- Publication Details
- IEEE photonics technology letters, v 23(3), pp 164-166
- Publisher
- IEEE
- Number of pages
- 3
- Grant note
- New York State Energy Research and Development Authority 0829915 / NSF; National Science Foundation (NSF) DE-FC52-08NA28302 / DOE Office of Inertial Confinement Fusion University of Rochester
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000286109600010
- Scopus ID
- 2-s2.0-78651309963
- Other Identifier
- 991019186637604721
UN Sustainable Development Goals (SDGs)
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InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Web of Science research areas
- Engineering, Electrical & Electronic
- Optics
- Physics, Applied