Journal article
A Full-Chip ESD Protection Circuit Simulation and Fast Dynamic Checking Method Using SPICE and ESD Behavior Models
IEEE transactions on computer-aided design of integrated circuits and systems, v 38(3), pp 489-498
01 Mar 2019
Abstract
Full-chip electrostatic discharge (ESD) protection circuit design verification is needed for complex ICs at advanced technology nodes despite being largely impractical due to the limitation of ESD device models and CAD tools. This paper reports a new circuit-level ESD protection design simulation and dynamic checking method using SPICE and ESD device behavior models which allows comprehensive, quantitative, and dynamic verification of ESD protection circuit designs at chip level-based entirely on ESD discharging functions. The new ESD protection circuit simulation method is validated using ICs designed and fabricated in a 28 nm CMOS. This ESD-function-based ESD circuit simulation method is technology independent, which can handle various ICs including complex multiple power domain circuits and ICs using nontraditional ESD protection structures.
Metrics
Details
- Title
- A Full-Chip ESD Protection Circuit Simulation and Fast Dynamic Checking Method Using SPICE and ESD Behavior Models
- Creators
- Feilong Zhang - University of California, RiversideChenkun Wang - University of California, RiversideFei Lu - Marvell (United States)Qi Chen - University of California, RiversideCheng Li - University of California, RiversideX. Shawn Wang - University of California, Los AngelesDaguang Li - TrustChip Technol Inc, Beijing 100195, Peoples R ChinaAlbert Wang - University of California, Riverside
- Publication Details
- IEEE transactions on computer-aided design of integrated circuits and systems, v 38(3), pp 489-498
- Publisher
- IEEE
- Number of pages
- 10
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000459500100009
- Scopus ID
- 2-s2.0-85044364690
- Other Identifier
- 991020836330504721
InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Collaboration types
- Industry collaboration
- Domestic collaboration
- International collaboration
- Web of Science research areas
- Computer Science, Hardware & Architecture
- Computer Science, Interdisciplinary Applications
- Engineering, Electrical & Electronic