Journal article
Chemical boundary lubrication in chemical–mechanical planarization
Tribology international, v 38(3), pp 235-242
2005
Abstract
Chemical–mechanical planarization (CMP) is a synergistic tribological process. It occurs between a polymeric polishing pad, a solid body to be made smooth, between which is a chemical slurry containing nanoparticles of abrasive materials. CMP functions similar to chemical boundary lubrication of mechanical systems, except that the objective of the CMP is to remove materials in a controlled manner. In this article, the lubricating behaviors of CMP are reviewed.
Metrics
Details
- Title
- Chemical boundary lubrication in chemical–mechanical planarization
- Creators
- Hong Liang - University of Alaska FairbanksHualou Liang - School of Biomedical Engineering, Science, and Health Systems (1997-)
- Publication Details
- Tribology international, v 38(3), pp 235-242
- Publisher
- Elsevier
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- School of Biomedical Engineering, Science, and Health Systems
- Web of Science ID
- WOS:000227195900005
- Scopus ID
- 2-s2.0-11444254916
- Other Identifier
- 991019320710804721
InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Web of Science research areas
- Engineering, Mechanical