Closed-Form Expressions of 3-D Via Resistance, Inductance, and Capacitance : Compact Interconnect Models for Gigascale Integration

Journal article

Peer reviewed

Ioannis Savidis and Eby G Friedman

IEEE transactions on electron devices, Vol.56(9), pp.1873-1881

2009

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Applied sciences

Electronics

Exact sciences and technology

Testing, measurement, noise and reliability

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Title: Closed-Form Expressions of 3-D Via Resistance, Inductance, and Capacitance : Compact Interconnect Models for Gigascale Integration
Creators: Ioannis Savidis - University of Rochester
Eby G Friedman - Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY 14627, United States
Publication Details: IEEE transactions on electron devices, Vol.56(9), pp.1873-1881
Publisher: Institute of Electrical and Electronics Engineers
Resource Type: Journal article
Language: English
Academic Unit: Electrical and Computer Engineering
Identifiers: 991019186625804721