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Deposition and characterization of silicon dioxide thin films deposited by mercury‐arc‐source driven photon‐activated chemical‐vapor deposition
Journal article

Deposition and characterization of silicon dioxide thin films deposited by mercury‐arc‐source driven photon‐activated chemical‐vapor deposition

Kevin J. Scoles, Anderson H. Kim, Mian‐Heng Jiang and Brian C. Lee
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, v 6(1), pp 470-472
Jan 1988

Abstract

CHEMICAL VAPOR DEPOSITION ALUMINIUM PERMITTIVITY THIN FILMS VLSI ULTRAVIOLET RADIATION SILICON STRESSES VERY HIGH TEMPERATURE ELECTRIC ARCS ETCHING SILICA FILM GROWTH SiO2 BREAKDOWN HIGH TEMPERATURE
Silicon dioxide thin films have been grown by the technique of photochemical‐vapor deposition. Deposition was performed using direct dissociation of oxygen by an ultraviolet arc lamp in the presence of silane. The films were deposited for a temperature range of 150 and 350 °C. Deposition rates peaked at a total pressure of 2 Torr, with a rate of 23 nm/min and 68 nm/min at 150 °C and 250 °C, respectively. Film stress is compressive with 1.04±0.14×109 dynes/cm2. Dielectric constant (εox) and breakdown voltage (V B ) were measured as 3.6 and 3.2 MV/cm, respectively. Etch rate in a room temperature 1:5 buffered hydrofluoric acid:deionized water solution was below 50 Å/s. The films have promise for application in integrated circuit devices.

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Web of Science research areas
Engineering, Electrical & Electronic
Nanoscience & Nanotechnology
Physics, Applied
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