Journal article
Development of non-destructive bond monitoring techniques for ultrasonic bonders
Ultrasonics, v 24(6), pp 307-317
1986
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
Simulation of an ultrasonic bonding tool was performed to formulate and analyse the relationships between the boundary conditions due to loading at the bond-tool interface and the measured parameters, such as the ultrasonic frequency and the input impedance variations during the bonding process. It is believed that improved process monitoring techniques can be developed based on the functional dependence between the ultrasonic frequency, input impedance variations and the boundary conditions at the bond-tool interface. Both experimental and simulation results obtained indicate that a strong dependence exists between the load, resonant frequency and the input impedance in an ultrasonic bonder. Resonant frequency was observed to increase as the loading on the bond surface increases.
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Details
- Title
- Development of non-destructive bond monitoring techniques for ultrasonic bonders
- Creators
- N.M. Bilgutay - Drexel UniversityXing Li - Drexel UniversityM. McBrearty - Drexel UniversityXiaowei Li - Materials Science and Engineering
- Publication Details
- Ultrasonics, v 24(6), pp 307-317
- Publisher
- Elsevier
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Materials Science and Engineering
- Web of Science ID
- WOS:A1986E658900001
- Scopus ID
- 2-s2.0-0022808102
- Other Identifier
- 991019173700404721
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InCites Highlights
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- Collaboration types
- Industry collaboration
- Domestic collaboration
- Web of Science research areas
- Acoustics
- Radiology, Nuclear Medicine & Medical Imaging