Journal article
Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry
Microelectronic engineering, v 75(1)
2004
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
We present a novel platform for the development and deployment of nanosensors in integrated systems. The nanosensor technology is based on “striped” high aspect ratio cylindrical structures grown using porous membranes as templates. These nanostructures are manipulated using dielectrophoretic forces, allowing their individual assembly and characterization. This assembly also enables the development of “mixed-mode” integrated circuits that include readout, signal processing, and communications circuitry, as well as the requisite layout for the post-IC assembly of the nanostructures. We report on preliminary designs of such mixed mode systems whose layouts integrate dielectrophoretic assembly sites with a rudimentary resistance read-out circuitry.
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Details
- Title
- Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry
- Creators
- S Evoy - Department of Electrical and Systems Engineering, The University of Pennsylvania, 200 S. 33rd St., Room 206, Philadelphia, PA 19104, USAN DiLello - Department of Electrical and Systems Engineering, The University of Pennsylvania, 200 S. 33rd St., Room 206, Philadelphia, PA 19104, USAV Deshpande - Department of Electrical and Systems Engineering, The University of Pennsylvania, 200 S. 33rd St., Room 206, Philadelphia, PA 19104, USAA Narayanan - Bradley Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061, USAH Liu - Department of Mechanical Engineering and Applied Mechanics, The University of Pennsylvania, Philadelphia, PA 19104, USAM Riegelman - Department of Mechanical Engineering and Applied Mechanics, The University of Pennsylvania, Philadelphia, PA 19104, USAB.R Martin - Department of Chemistry, Pennsylvania State University, University Park, PA 16802, USAB Hailer - Department of Materials Science and Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061, USAJ.-C Bradley - Department of Chemistry, Drexel University, Philadelphia, PA, 19104, USAW Weiss - Department of Chemistry, Pennsylvania State University, University Park, PA 16802, USAT.S Mayer - Department of Electrical Engineering, Pennsylvania State University, University Park, PA 16802, USAY Gogotsi - Department of Materials Science & Engineering, Drexel University, Philadelphia, PA 19104, USAH.H Bau - Department of Mechanical Engineering and Applied Mechanics, The University of Pennsylvania, Philadelphia, PA 19104, USAT.E Mallouk - Department of Chemistry, Pennsylvania State University, University Park, PA 16802, USAS Raman - Bradley Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061, USA
- Publication Details
- Microelectronic engineering, v 75(1)
- Publisher
- Elsevier
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Materials Science and Engineering
- Web of Science ID
- WOS:000222459800005
- Scopus ID
- 2-s2.0-2942579312
- Other Identifier
- 991014877883104721
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InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Collaboration types
- Domestic collaboration
- Web of Science research areas
- Engineering, Electrical & Electronic
- Nanoscience & Nanotechnology
- Optics
- Physics, Applied