Journal article
Direct observation of recrystallization mechanisms during annealing of Cu in low and high strain conditions
Scripta materialia, v 146, pp 308-311
15 Mar 2018
Abstract
Recrystallization and subsequent twin formation in >99.99% pure copper is investigated by in situ annealing in a scanning electron microscope. Distinct microstructural evolution mechanisms are observed for specimens deformed using 5% and 25% cold-rolled reductions. Upon annealing the former, growth and twinning of existing grains via strain-induced boundary migration is observed while the latter exhibits nucleation and growth. Serial sectioning indicates that recrystallization in the low strain condition is surface dominant while nucleation occurs through thickness in the high strain condition. Geometrically necessary dislocation densities are calculated and mapped to identify the localized driving pressures for each recrystallization mechanism. (C) 2017 Published by Elsevier Ltd on behalf of Acta Materialia Inc.
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Details
- Title
- Direct observation of recrystallization mechanisms during annealing of Cu in low and high strain conditions
- Creators
- A. Nye - Drexel UniversityA. C. Leff - Drexel UniversityChristopher M. Barr - Drexel UniversityM. L. Taheri - Drexel UniversityJason E Cohn
- Publication Details
- Scripta materialia, v 146, pp 308-311
- Publisher
- Elsevier
- Number of pages
- 4
- Grant note
- 1150807 / National Science Foundation's Early Career Program; National Science Foundation (NSF)
- Resource Type
- Journal article
- Language
- English
- Web of Science ID
- WOS:000424719400068
- Scopus ID
- 2-s2.0-85038853992
- Other Identifier
- 991019353723004721
InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Collaboration types
- Domestic collaboration
- Web of Science research areas
- Materials Science, Multidisciplinary
- Metallurgy & Metallurgical Engineering
- Nanoscience & Nanotechnology