Journal article
Effect of indentation unloading conditions on phase transformation induced events in silicon
Journal of materials research, v 18(5), pp 1192-1201
May 2003
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
More than 2500 indentations were made on a silicon wafer surface using a range of different unloading rates and maximum applied loads. The unloading curves were examined for characteristic events (pop-out, kink pop-out, elbow followed by pop-out, and elbow) that were assigned to different phase transitions within the affected material based on Raman microspectroscopy analysis of residual imprints. The effect of unloading rate and maximum applied load on the average contact pressure at the beginning of the event was found. A permissible range for each event to occur was established.
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Details
- Title
- Effect of indentation unloading conditions on phase transformation induced events in silicon
- Creators
- Tom Juliano - Department of Materials Engineering, Drexel University, Philadelphia, Pennsylvania 19104Yury Gogotsi - Department of Materials Engineering, Drexel University, Philadelphia, Pennsylvania 19104Vladislav Domnich - Department of Materials Engineering, Drexel University, Philadelphia, Pennsylvania 19104
- Publication Details
- Journal of materials research, v 18(5), pp 1192-1201
- Publisher
- Cambridge University Press; New York, USA
- Number of pages
- 10
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Materials Science and Engineering
- Web of Science ID
- WOS:000182586600025
- Scopus ID
- 2-s2.0-0038337938
- Other Identifier
- 991014969774204721
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- Web of Science research areas
- Materials Science, Multidisciplinary