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Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits
Journal article   Peer reviewed

Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits

Ioannis Savidis, Syed M. Alam, Ankur Jain, Scott Pozder, Robert E. Jones and Ritwik Chatterjee
Microelectronics Journal, v 41(1), pp 9-16
2010
DOI: https://doi.org/10.1016/j.mejo.2009.10.006

Abstract

3D integration Electrical characterization IO delay TSV Via parasitics Vias
The integration of chips in the third dimension has been explored to address various physical and system level limitations currently undermining chip performance. In this paper, we present a comprehensive analysis of the electrical properties of through silicon vias and microconnects with an emphasis on single via characteristics as well as inter-TSV capacitive and inductive coupling in the presence of either a neighboring ground tap or a grounded substrate back plane. We also analyze the impact of technology scaling on TSV electrical parasitics, and investigate the power and delay trend in 3-D interstratum IO drivers with those of global wire in 2-D circuits over various technology nodes. We estimate the global wire length necessary to produce an equivalent 3-D IO delay, a metric useful in early stage design tools for 3D floorplanning that considers the electrical characteristics of 3D connections with TSVs and microconnects.

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63 citations in Web of Science
78 citations in Scopus

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Collaboration types
Industry collaboration
Domestic collaboration
Web of Science research areas
Engineering, Electrical & Electronic
Nanoscience & Nanotechnology
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