Journal article
Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits
IEEE transactions on very large scale integration (VLSI) systems, v 23(10), pp 2077-2089
Oct 2015
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
A 3-D test circuit examining thermal propagation within a through-silicon via-based 3-D integrated stack has been designed, fabricated, and tested. Design insight into thermal coupling in 3-D integrated circuits (ICs) through both experiment and simulation is provided, and suggestions to mitigate thermal effects in 3-D ICs are offered. Two wafers are vertically bonded to form a 3-D stack. Intraplane and interplane thermal coupling is investigated through single-point heat generation using resistive thermal heaters and temperature monitoring through four-point resistive measurements. Thermal paths are identified and analyzed based on the metric of thermal resistance per unit length. The peak steady-state temperature due to die location within a 3-D stack is described. The reduction in peak temperature through fan-based active cooling is also reported. Thermal propagation from a heat source located on the backside of the silicon is examined with both back metal and on-chip thermal sensors. A comparison of thermal coupling between two different heat sources on the same device plane is also provided.
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Details
- Title
- Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits
- Creators
- Ioannis Savidis - Drexel UniversityBoris Vaisband - University of RochesterEby G Friedman - University of Rochester
- Publication Details
- IEEE transactions on very large scale integration (VLSI) systems, v 23(10), pp 2077-2089
- Publisher
- IEEE
- Grant note
- 2012139 / Binational Science Foundation Samsung Electronics, San Diego, CA, USA CCF-1329374 / National Science Foundation (10.13039/100000001) Qualcomm Corporation, San Diego, CA, USA Cisco Systems, San Jose, CA, USA
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000364208500010
- Other Identifier
- 991019168591504721
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- Collaboration types
- Domestic collaboration
- Web of Science research areas
- Computer Science, Hardware & Architecture
- Engineering, Electrical & Electronic