Journal article
First Thermal and Fluids Engineering Summer Conference
First Thermal and Fluids Engineering Summer Conference, pp 1747-1750
2015
Abstract
Pool boiling heat transfer has been investigated using a novel enhancement technique based on in-plane variations in surface thermal conductivity. By embedding regions of low-conductivity epoxy within a high-conductivity copper substrate increases in critical heat flux (CHF) of up to 100%, and heat transfer coefficient (HTC) of over 400% at moderate superheats have been achieved as compared to bare copper surfaces. The combination of nanostructured coatings onto the novel 'bi-conductive' surfaces yields additional enhancements in both CHF and HTC. Hydrothermally grown copper oxide (CuO) nanostructures as well as biotemplated nickel nanostructures have been used to create surfaces with heterogeneous architectures, demonstrating CHF up to 307 W/cm2 and HTC of up to 250 kW/m2K. The role of each component and their combinations has been investigated, leading to insights into the underlying enhancement mechanisms.
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Details
- Title
- First Thermal and Fluids Engineering Summer Conference
- Creators
- Md Mahamudur Rahman - Drexel UniversityEmre Olceroglu - Drexel UniversityMatthew McCarthy - Drexel University
- Publication Details
- First Thermal and Fluids Engineering Summer Conference, pp 1747-1750
- Publisher
- Begell House Inc
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Mechanical Engineering and Mechanics
- Other Identifier
- 991021934113904721