Journal article
Heterogeneous 3-D circuits: Integrating free-space optics with CMOS
Microelectronics Journal, v 50, pp 66-75
Apr 2016
Featured in Collection : UN Sustainable Development Goals @ Drexel
Abstract
A three-dimensional (3-D) integrated circuit combining free-space optical interconnects (FSOI) with CMOS devices has been developed. An overview of the combined optical and CMOS system is described. Experimental data and simulated results are provided. A 3-D integrated test circuit merging the free-space optical network with gallium arsenide based vertical cavity surface emitting lasers (VCSELs) and germanium based photodetectors has been experimentally tested. The prototype 3-D IC test circuit exhibits a 3.3GHz bandwidth and a 5.1mW total power consumption per link. The bandwidth is limited due to the use of 5GHz bandwidth commercial VCSELs and the large inductive impedance of the wirebonds attaching the VCSELs and photodetectors to the I/O pads. The design of transmitter circuits for the 3-D integrated free-space optical interconnect system is discussed, and simulated extrapolated results on operating frequency and bandwidth are provided. The microprocessor operates at 333MHz and includes a bus width of 64bits, requiring a FSOI bandwidth of 10.65Gbps after serialization.
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Details
- Title
- Heterogeneous 3-D circuits: Integrating free-space optics with CMOS
- Creators
- Ioannis Savidis - Department of Electrical and Computer Engineering, Drexel University, Philadelphia, PA 19104, United StatesBerkehan Ciftcioglu - Institute of Optics, University of Rochester, Rochester, NY 14627, United StatesJie Xu - Institute of Optics, University of Rochester, Rochester, NY 14627, United StatesJianyun Hu - Institute of Optics, University of Rochester, Rochester, NY 14627, United StatesManish Jain - Institute of Optics, University of Rochester, Rochester, NY 14627, United StatesRebecca Berman - Institute of Optics, University of Rochester, Rochester, NY 14627, United StatesJing Xue - Institute of Optics, University of Rochester, Rochester, NY 14627, United StatesPeng Liu - Institute of Optics, University of Rochester, Rochester, NY 14627, United StatesDuncan Moore - Institute of Optics, University of Rochester, Rochester, NY 14627, United StatesGary Wicks - Institute of Optics, University of Rochester, Rochester, NY 14627, United StatesMichael Huang - Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY 14627, United StatesHui Wu - Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY 14627, United StatesEby G Friedman - Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY 14627, United States
- Publication Details
- Microelectronics Journal, v 50, pp 66-75
- Publisher
- Elsevier
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000371908200009
- Scopus ID
- 2-s2.0-84959087592
- Other Identifier
- 991014878035804721
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- Collaboration types
- Domestic collaboration
- Web of Science research areas
- Engineering, Electrical & Electronic
- Nanoscience & Nanotechnology