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Microelectronics: Stamping of Flexible, Coplanar Micro‐Supercapacitors Using MXene Inks (Adv. Funct. Mater. 9/2018)
Journal article   Open access   Peer reviewed

Microelectronics: Stamping of Flexible, Coplanar Micro‐Supercapacitors Using MXene Inks (Adv. Funct. Mater. 9/2018)

Chuanfang (John) Zhang, Matthias P Kremer, Andrés Seral‐Ascaso, Sang‐Hoon Park, Niall McEvoy, Babak Anasori, Yury Gogotsi and Valeria Nicolosi
Advanced functional materials, v 28(9), pp 1870059-n/a
28 Feb 2018
DOI: https://doi.org/10.1002/adfm.201870059
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https://doi.org/10.1002/adfm.201870059View
Published, Version of Record (VoR)Maybe Open Access (Publisher Bronze),  Open

Abstract

areal capacitance MXene ink stamping micro‐supercapacitor 3D printing
In article number 1705506, Chuanfang (John) Zhang, Yury Gogotsi, Valeria Nicolosi, and co‐workers report the fabrication of flexible, solid‐state, high‐performance micro supercapacitors using 3D‐printed stamps and MXene inks for future wearable personal electronic devices. The image shows lab‐scale mass production of flexible supercapacitors using a roller stamp and paper substrate. These devices feature high capacitance, long lifetime and fast charging.

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