Journal article
Multichip Module Diagnosis by Product-Code Signatures
Journal of electronic testing, v 10(1-2), pp 127-136
01 Feb 1997
Abstract
A system diagnosis technique for multichip module (MCM) ispresented. The proposed technique uses built-in probes for monitoringinternal responses and, with a signature analysis scheme based onerror correcting codes, identifies the probes where erroneous test responses have been detected. Conceptsfrom system diagnosis is used in conjunction withsignature analysis in developing the proposed MCM diagnosistechnique, where the resulting patterns of the faulty probes are usedin the identification of the faulty submodules (dies). The proposedtechnique offers a diagnostic capability in system functional test.[PUBLICATION ABSTRACT]
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Details
- Title
- Multichip Module Diagnosis by Product-Code Signatures
- Creators
- P Nagvajara - Drexel UniversityJ Lin - Drexel UniversityP Nilagupta - Drexel UniversityC Wang - Drexel University
- Publication Details
- Journal of electronic testing, v 10(1-2), pp 127-136
- Publisher
- Springer Nature B.V
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:A1997XD89800014
- Scopus ID
- 2-s2.0-0031071254
- Other Identifier
- 991019168003204721
InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Web of Science research areas
- Engineering, Electrical & Electronic