Numerical Studies of Non-Newtonian Channel Flow and Heat Transfer Enhancement for Electronics Modules

Journal article

Peer reviewed

F. C Chou, F. K Tsou and C. W Tung

Journal of electronic packaging, v 117(3), pp 246-249

01 Sep 1995

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2 citations in Scopus

Title: Numerical Studies of Non-Newtonian Channel Flow and Heat Transfer Enhancement for Electronics Modules
Creators: F. C Chou - National Central University
F. K Tsou - Drexel University
C. W Tung - National Central University
Publication Details: Journal of electronic packaging, v 117(3), pp 246-249
Publisher: ASME
Resource Type: Journal article
Language: English
Academic Unit: [Retired Faculty]
Web of Science ID: WOS:A1995TT21500014
Scopus ID: 2-s2.0-0029368543
Other Identifier: 991019182648204721

Data related to this publication, from InCites Benchmarking & Analytics tool:

Collaboration types: Domestic collaboration; International collaboration
Web of Science research areas: Engineering, Electrical & Electronic; Engineering, Mechanical