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Optical Evaluation of Silicon Wafers With Rounded Rear Pyramids
Journal article   Peer reviewed

Optical Evaluation of Silicon Wafers With Rounded Rear Pyramids

Keith R McIntosh, Ngwe Zin, Hieu T Nguyen, Matthew Stocks, Evan Franklin, Kean C Fong, Teng C Kho, Teck K Chong, Er-Chien Wang, Tom Ratcliff, …
IEEE journal of photovoltaics, v 7(6), pp 1596-1602
Nov 2017
url
https://stars.library.ucf.edu/scopus2015/5326View
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Abstract

Light trapping Passivation Photoluminescence photoluminescence spectroscopy (PLS) Ray tracing Silicon solar cells Surface morphology texture
We investigate the light trapping in Si wafers that are textured with conventional random pyramids on their front surface and rounded random pyramids on their rear. It is well established that rounding the pyramids leads to better surface passivation, but whether or not it improves light trapping depends on the cell structure. In this paper, we apply ray tracing, spectrophotometry, and photoluminescence spectroscopy (PLS) to understand and quantify how rounding the rear pyramids might affect the light trapping in back-contact solar cells. We describe how rounding the pyramids leads to two competing optical effects: 1) reduced absorption in the rear films and 2) reduced scattering from the rear texture. The first effect improves light trapping whereas the latter degrades it. We show how the influence of each effect depends on wavelength and how they can be discerned (but not easily quantified) in reflectance curves. With PLS measurements, we conclude that for our sample structure and etch solution, the generation current is approximately constant for etch durations less than ~60 s, and decreases significantly as the etch duration increases. Thus, by limiting the duration of the rounding etch, superior surface passivation can be attained without degrading the light trapping.

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11 citations in Scopus

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Collaboration types
Domestic collaboration
International collaboration
Web of Science research areas
Energy & Fuels
Materials Science, Multidisciplinary
Physics, Applied
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