Journal article
Quantification of void pinning effects during grain growth of nanocrystalline iron
Journal of nuclear materials, v 481, pp 62-65
01 Dec 2016
Abstract
In-situ transmission electron microscopy (TEM) annealing experiments, coupled with an analytical model, compared void pinning effects in nanocrystalline Fe films during grain growth. Voided grain boundaries were shown to have nearly four orders of magnitude less grain boundary mobility than void-free grain boundaries. However the coverage of the grain boundaries by pores was over three times that which would be required for static particles to completely halt grain boundary migration. Grain boundary migration continued because the pores were dragged by the grain boundaries and continued to evolve and coalesce. Thus, pores can slow grain boundary migration but are not an effective means of fully stabilizing nanocrystalline grain size at high temperatures. (C) 2016 Elsevier B.V. All rights reserved.
Metrics
Details
- Title
- Quantification of void pinning effects during grain growth of nanocrystalline iron
- Creators
- G. A. Vetterick - Drexel UniversityO. El-Atwani - Drexel UniversityJ. Kevin Baldwin - Center for Integrated NanotechnologiesM. R. Tonks - Pennsylvania State UniversityM. L. Taheri - Drexel University
- Publication Details
- Journal of nuclear materials, v 481, pp 62-65
- Publisher
- Elsevier
- Number of pages
- 4
- Grant note
- DE-SC0008274 / DOE Basic Energy Sciences; United States Department of Energy (DOE) Department of Energy Nuclear Energy Advanced Modeling and Simulation program; United States Department of Energy (DOE)
- Resource Type
- Journal article
- Language
- English
- Web of Science ID
- WOS:000386822900007
- Scopus ID
- 2-s2.0-84987973941
- Other Identifier
- 991019335226704721
InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Collaboration types
- Domestic collaboration
- Web of Science research areas
- Materials Science, Multidisciplinary
- Nuclear Science & Technology