Journal article
Resonant Clock Synchronization With Active Silicon Interposer for Multi-Die Systems
IEEE transactions on circuits and systems. I, Regular papers, v 68(4), pp 1636-1645
Apr 2021
Abstract
This paper presents the integration of resonant clocking to multi-die architectures to synchronize individual chiplets connected through an active silicon interposer. The proposed inter-chiplet synchronization through the active silicon interposer rotary oscillator array (ASI-ROA) provides a unitary clock domain to the multiple die (i.e. multiple chiplets) in the package with a very low design overhead. System performance analysis is performed with parasitics-extracted, post-layout simulation models of two different sizes of representative heterogeneous multi-die architectures, each with varying number of RISC-V cores per die. Each RISC-V core of the multi-die package belongs to the unitary clock domain, designed with ASI-ROA to operate at a frequency of 2 GHz. The proposed architecture is investigated for robustness in frequency and skew across the multi-die system (MDS) with SPICE based simulations of post layout models, demonstrating variations of only 80 MHz for a 2 GHz target frequency. The power savings are upto 41% for the overall MDS, compared to an equivalent implementation with a contemporary ADPLL used to synchronize the multiple chiplets over the active interposer. The average clock skew of the completely resonant architecture presented in this work is 8.2 ps.
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Details
- Title
- Resonant Clock Synchronization With Active Silicon Interposer for Multi-Die Systems
- Creators
- Ragh Kuttappa - Drexel UniversityBaris Taskin - Drexel UniversityScott Lerner - Drexel UniversityVasil Pano - Drexel University
- Publication Details
- IEEE transactions on circuits and systems. I, Regular papers, v 68(4), pp 1636-1645
- Publisher
- IEEE
- Grant note
- 1816857; 2008629 / National Science Foundation (10.13039/100000001)
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000626527600023
- Scopus ID
- 2-s2.0-85101747470
- Other Identifier
- 991019168118104721
InCites Highlights
Data related to this publication, from InCites Benchmarking & Analytics tool:
- Web of Science research areas
- Engineering, Electrical & Electronic