Special issue on IEEE/ACM System Level Interconnect Prediction (SLIP) Workshop 2016

Journal article

Peer reviewed

Tsung-Yi Ho and Baris Taskin

Integration (Amsterdam), v 58, pp 225-225

01 Jun 2017

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Title: Special issue on IEEE/ACM System Level Interconnect Prediction (SLIP) Workshop 2016
Creators: Tsung-Yi Ho - Natl Tsing Hua Univ, Dept Comp Sci, 101,Sec 2,Kuang Fu Rd, Hsinchu 30013, Taiwan
Baris Taskin - Drexel University
Publication Details: Integration (Amsterdam), v 58, pp 225-225
Publisher: Elsevier
Number of pages: 1
Resource Type: Journal article
Language: English
Academic Unit: Electrical and Computer Engineering
Web of Science ID: WOS:000405052700022
Scopus ID: 2-s2.0-85020877833
Other Identifier: 991019168316204721

Data related to this publication, from InCites Benchmarking & Analytics tool:

Collaboration types: Domestic collaboration; International collaboration
Web of Science research areas: Computer Science, Hardware & Architecture; Engineering, Electrical & Electronic